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Invitation to the 22nd China International Optoelectronics Expo

2021-04-14 11:51:03

Invitation to the 22nd China International Optoelectronics Expo

Chengdu Apex New Materials Co., Ltd. will participate in the 22nd CIOE China International Optoelectronic Expo in Shenzhen International Convention and Exhibition Center from September 9th to 11th, 2020 (Wednesday to Friday). We sincerely invite you to visit, guide, exchange and negotiate business.

 

With 22 years of deep cultivation in the industry, China International Optoelectronic Expo has gathered superior resources of optoelectronic industry. Six exhibitions covering information communication, data center, laser, infrared, precision optics, lens and module, machine vision, optoelectronic sensing, etc. are held in the same period of China International Optoelectronic Expo. They are oriented to optical communication, information processing and storage, consumer electronics, advanced manufacturing, national defense and security, semiconductor processing, energy, sensing and testing. It is a one-stop business, technology and exchange platform for people in the industry to seek new technologies and products and understand market opportunities.


About us

Chengdu Apex New Materials Co., Ltd., established in December 2016, introduces foreign advanced technology and focuses on the independent research, development, generation and sales of advanced alloy materials in the field of electronic packaging: high clean preformed alloy solder pad / strip, pre-set gold tin cover plate, low thermal expansion silicon aluminum alloy. It is committed to the independent research, development, generation and sales of electronic packaging, microwave, aerospace, optical communication, high-power power electronics, 5G , artificial intelligence, new energy vehicles, medical devices and other customers to provide quality products and professional process solutions.

 

Main products

Solder Performs:Au80Sn20、Au88Ge12、Au96.85Si3.15

Other alloy solder:In97Ag3、 Ag72Cu28、Sn96.5Ag3.0Cu0.5

Au80Sn20 Solder Seal Lid

Silicon Aluminium Alloy:AlSi27、AlSi50、AlSi70、Al4047

 

Exhibition products

01 Solder Performs

Apex New Material's solder preforms is a kind of solder sheet with high clean and flat surface, which is commonly used in the welding of ceramics, kovar alloy, chips, IC packaging, metal shell and so on. According to the specific needs of customers, we can customize various shapes of preformed solder pads, including strip, rectangle, square, square frame, circle, ring, ellipse and non-standard shapes.

02 Au80Sn20 Solder Seal Lid

Au80Sn20 Solder Seal Lid using Kovar™ or Alloy42, through nickel plating, then gold plating, spot welding to solder preform. The nickel layer can inhibit corrosion, while the gold layer can promote weldability and prolong shelf life. Au80Sn20 Solder Seal Lid has good wettability with the gold tin solder, which can improve the reliability of the cover plate. 

03 Silicon Aluminium Alloy

Silicon Aluminium Alloy is the first alloy product in the world to meet the requirements of expansion rate from 5ppm / ℃ to 22ppm / ℃. Its silicon content is 10% - 70%. Silicon Aluminium Alloy with different properties can be obtained by adjusting the volume fraction of silicon. Low expansion Silicon Aluminium Alloy has the characteristics of low cost, light weight, high thermal conductivity, high stiffness, low thermal expansion, high machining and surface coating performance and welding performance. Using silicon aluminum alloy as the base, shell and cover plate of electronic packaging materials has good matching and heat dissipation, which can greatly extend the service life of high-power module and increase reliability.

Apex New Materials in hall 8-8E011 looking forward to your arrival.