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Participated in the Sixth National Symposium on new semiconductor power devices and Application Tech

2021-04-14 14:29:22

Participated in the Sixth National Symposium on new semiconductor power devices and Application Technology

 

From October 28 to 30, 2020, the Sixth National Symposium on new semiconductor power devices and application technology, sponsored by China Semiconductor Industry Association, was successfully held in Crowne Plaza Hotel, Chengdu. This conference is another important academic and technical exchange activity in the field of new semiconductor power devices and applications after the successful holding of Xiamen, Kunming, Changsha, Suzhou and Shenzhen. It provides a high starting point, large-scale and multi field communication platform for the majority of workers engaged in new semiconductor power materials, devices and their applications, and enhances the technical exchange between units.

 Participated in the Sixth National Symposium on new semiconductor power devices and Application Tech(图1)

As the support unit of this conference, Chengdu Apex New Materials Co.,Ltd is a domestic brand of independent research and development, production and sales of advanced alloy materials. It has brought the latest products to participate in this conference, which has been widely concerned by the majority of new and old customers and peers.

 

01 Solder Performs

Participated in the Sixth National Symposium on new semiconductor power devices and Application Tech(图2)

Apex New Material's solder preforms is a kind of solder sheet with high clean and flat surface, which is commonly used in the welding of ceramics, kovar alloy, chips, IC packaging, metal shell and so on. According to the specific needs of customers, we can customize various shapes of preformed solder pads, including strip, rectangle, square, square frame, circle, ring, ellipse and non-standard shapes.

Preformed wafers are widely used in many fields, such as reliable package connection, metal shell or ceramic shell hermetic package welding.

 

02 Au80Sn20 Solder Seal Lid

Participated in the Sixth National Symposium on new semiconductor power devices and Application Tech(图3)

Au80Sn20 Solder Seal Lid using Kovar™ or Alloy42, through nickel plating, then gold plating, spot welding to solder preform. The nickel layer can inhibit corrosion, while the gold layer can promote weldability and prolong shelf life. Au80Sn20 Solder Seal Lid has good wettability with the gold tin solder, which can improve the reliability of the cover plate.

 

03 Silicon Aluminium Alloy

Participated in the Sixth National Symposium on new semiconductor power devices and Application Tech(图4)

Silicon Aluminium Alloy is the first alloy product in the world to meet the requirements of expansion rate from 5ppm / ℃ to 22ppm / ℃. Its silicon content is 10% - 70%. Silicon Aluminium Alloy with different properties can be obtained by adjusting the volume fraction of silicon. Low expansion Silicon Aluminium Alloy has the characteristics of low cost, light weight, high thermal conductivity, high stiffness, low thermal expansion, high machining and surface coating performance and welding performance. Using silicon aluminum alloy as the base, shell and cover plate of electronic packaging materials has good matching and heat dissipation, which can greatly extend the service life of high-power module and increase reliability.

 

 Participated in the Sixth National Symposium on new semiconductor power devices and Application Tech(图5)

Although the Sixth National Symposium on new semiconductor power devices and application technology has been successfully concluded, our pace of technological innovation will not stop. With the enterprise concept of "innovation, integrity and hard work", Chengdu Apex New Materials will provide a series of high-quality products and supporting services for customers in the fields of optical communication, 5g, laser, semiconductor integrated circuit, IGBT packaging, new energy, aerospace, microwave, power electronics, new energy vehicles, etc., and at the same time provide customers with We are looking forward to further negotiation and cooperation with you.