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Participate in 2021 Shanghai international semiconductor Exhibition

2021-04-14 15:17:26

Participate in 2021 Shanghai international semiconductor Exhibition

The three-day SEMICON China 2021 exhibition was successfully concluded at the Shanghai New International Expo Center on the afternoon of March 19th, 2021. Thank you for the new and old customers who come to visit us. Thank you for meeting. Because of you, we will continue to work hard and keep going.

Participate in 2021 Shanghai international semiconductor Exhibition(图1)

 Participate in 2021 Shanghai international semiconductor Exhibition(图2)

Exhibition products

In this SEMICON China 2021 Shanghai exhibition, Apex New Materials, with its self-developed and self-produced Solder Preforms Au80Sn20, Au80Sn20 Solder Seal Lid and silicon aluminum alloys, appeared.

1 Solder Preforms

 Participate in 2021 Shanghai international semiconductor Exhibition(图3)

Participate in 2021 Shanghai international semiconductor Exhibition(图4)

2 Au80Sn20 Solder Seal Lid

Participate in 2021 Shanghai international semiconductor Exhibition(图5)

3 Low Expansion Silicon Aluminium Alloys

Participate in 2021 Shanghai international semiconductor Exhibition(图6)

The exhibition scene

Participate in 2021 Shanghai international semiconductor Exhibition(图7)

Participate in 2021 Shanghai international semiconductor Exhibition(图8)

Participate in 2021 Shanghai international semiconductor Exhibition(图9)

During the exhibition, Apex New Materials discussed and exchanged with customers on site to solve their doubts and provide electronic packaging solutions, which were widely recognized by customers! Thanks for your support and company! In the future, we will continue to update our existing products, and continue to inject new forces, research and develop new products, constantly improve the enterprise's innovation ability, serve customers, and contribute to the development of optical communication, 5g, laser, semiconductor integrated circuit, IGBT packaging, new energy, aerospace, microwave, power electronics, new energy vehicles and other fields! Looking forward to our next meeting.